MWC: Big Picture Experience from Mobile Devices is One Step Closer to Reality
Posted by gasusan2005 on 02/11/08 in Mobile World Congress, Texas Instruments
Texas Instruments DLP announces production availability of new imaging chipsets for pico-projection in 2008
DLP Technology from Texas Instruments (TI), announced today production availability of a DLP Pico chipset, which includes an imaging chip and a processor to enable a new class of handheld and mobile projection products. These ground breaking chips, which will be available in the second half of 2008, deliver functionality that will improve the visual display experience from handheld devices and transform their use from “tiny screen” viewing to “big picture” viewing allowing others to share in the video and graphics experience. The DLP pico-projector prototype will be on display in the Texas Instruments booth located in Hall 8, #8A84 at the 2008 GSMA Mobile World Congress.
Building upon the recent excitement and momentum DLP generated at the
2008 International Consumer Electronics Show in January where the
pico-projector garnered several best of show awards from top outlets, the
DLP Pico chipset is geared to meet the growing mobile needs of consumers
for communication and entertainment devices. While tiny by nature and
easily able to fit into a mobile device, this new DLP offering produces
unmatched image quality that leverages the core technologies behind
hallmark DLP home theater projectors and DLP Cinema.
Taking multimedia content beyond the confines of mobile devices, the
DLP Pico chipset can be paired with a TI OMAP application processor to
deliver the ultimate mobile user experience. The best-in-class imaging,
video and graphics processing capabilities enabled by OMAP processors,
paired with the DLP Pico chipset projection and imaging capabilities
provide the perfect combination for “big picture” viewing of content stored
on mobile devices.
“Transforming and improving the way content is experienced from mobile
devices has taken a giant step forward with the announcement of production availability of DLP Pico chipset,” said Frank J. Moizio, business manager, emerging markets for TI’s DLP Front Projection. “Working with our partners (Foxconn, Sypro, and Young Optics), we are delighted by the image quality that this chipset is capable of producing in their products — it truly has to be seen to be believed.”
“Texas Instruments is making headway in an untapped market and appears to be forging a leadership position. We expect projection within handset devices to start appearing in 2009, in a market where significant volumes are expected over the next five years.” said Bill Coggshall, founder of independent projector market research experts Pacific Media Associates.
“This is an exciting time for the projection industry and TI is leading the
way.
The DLP Pico chipset will consist of the DLP Pico(TM) chip and the DLP Pico processor (DDP1500 and DDP1505). The DPP1500 is targeted at
embedded applications for handheld devices, while the DDP1505 will serve
the standalone handheld companion market. The DLP Pico solution delivers an aperture ratio of more than 92 percent, tens of thousands of pixel
elements, switching speeds of less than 20 microseconds and DarkChip
native contrast ratio process technology. In addition, the chipset is
capable of displaying the widest color gamuts possible with the flexibility
to operate with the latest in LED illumination technology. DLP enables
safe, affordable and reliable products that will not fade or degrade over
time and use.
With more than 15 million units shipped to date, DLP has an excellent
track record of meeting the demand associated with the high volume mobile
device market. This new chip builds upon a tradition of reliability
associated with DLP which is known for industry-leading picture
reliability.
Source: Texas Instruments press release
Written by gasusan2005 · Filed Under Mobile World Congress, Texas Instruments
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